Introduction Services Compliance Downloads

Others

Encapsulation

Encapsulation is a method of protecting a populated PCB usually using an expoxy resin. The protection can be from moisture ingress or it could be a security facet to avoid circuit tamper.

Due to the security nature of our core business Stonewood EMS are experts in potting and encapsulation and currently control a very successful process and efficient yield.

Lazer etch

The Electrox FleXYZ system is fitted with a high powered EF Technology laser. It is suitable for marking complex designs, logos, 2D/3D barcodes and standard text onto a range of materials including plastics, metals and resins. Markings from the top of integrate circuits can be removed without damaging the sensitive silicon inside.

CD/DVD Print and Burn

Manufacturing utilize our Verity CD/DVD to securely duplicate over 2000 disks per month.

Integration

Manufacturing has a specialist integration department that is contained within our secure facility and is segregated from our production areas. The department has its own dedicated team able to test laptops for compatibility with our drives and perform integration and installation in line with customer requirements.


In-Circuit Test

Teradyne Spectrum 8852 Download Specification

  • 2,560 maximum channels and equipped with 1024 hybrid test channels

  • Delta Scan

  • Frame Scan

Functional Test

Our experienced in-house test technicians provide functional test of product using customer specified procedures and equipment. Test jig design consultancy can be provided.

Stress Testing

Stonewood have a climatic environmental chamber to test temperature stress of products.
Stonewood currently provide automated Optical Inspection on all of our surface mount assemblies.


AOI

The Saki BF18D-P40 is the perfect low cost alternative to In-Circuit test. Inspection capabilities include

  • Missing component

  • Shifted component

  • Missaligned component

  • Tombstoning

  • Reverse polarity

  • Solder bridge

  • Dirt or Dust presence

  • No solder

  • Insufficient solder

  • Dry joint

  • Lifted component

  • Lifted lead

  • Uninsertion of component

  • Optical Characture Recognition / Verification

 
SecurityLaptopCircuit